Cadence Advances RF Design with Latest AWR Design Environment Platform

Strong points:

  • AWR V16 Advances Development of Heterogeneous Technologies for 5G Wireless and Connected Automotive Systems, Radar Systems and Semiconductor Technologies

  • Custom mmWave RF IP developed with AWR software is now accessible on all Cadence design platforms, providing seamless solutions for wireless systems

  • Fundamental advancement in RF workflows of integrated circuits, packages and printed circuits accelerates design times to align with customer delivery times in the end market

  • Fully integrated FEA solver technologies provide precise analysis of multiphysics systems (EM and thermal) with near-linear scalability and capacity

SAN JOSE, California, June 22, 2021– (COMMERCIAL THREAD) – Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the AWR Design Environment® Version 16 (V16) with revolutionary cross-platform interoperability to support millimeter wave (mmWave) RF (RF IP) intellectual property integration for heterogeneous technology development across the industry leader Cadence® Virtuoso® design platform as well as the Allegro® PCB and IC package design platforms. Version V16 also introduces seamless integration with the Clarity 3D and Celsius solver Thermal solver, providing unconstrained capability for electrothermal performance analysis of complex and large-scale RF systems. The new AWR design environment, including Microwave Office® circuit design software, enables customers to efficiently design 5G wireless and connected systems for automotive, radar and semiconductor technologies and get to market faster. The integration of the platform and the solver in version V16 can reduce execution time (TAT) by up to 50% compared to competing workflows.

“To win in today’s highly competitive 5G / wireless markets, customers are demanding solutions that enable complete, comprehensive RF workflows that don’t just start and stop at the chip, but extend to it. ‘whole system,’ said Vinod Kariat, vice president of the company. research and development at Cadence. “The RF workflow innovations enabled by AWR Design Environment V16 begin with a fundamental advancement in the way design data and software intellectual property are now shared and seamlessly transferred between products. Under the overall umbrella of Cadence, the level of RF integration introduced with this is truly a breakthrough for the productivity of the engineering team. “

Interoperability of the platform is crucial to accelerate RF integration and promote engineering productivity. The seamless sharing of design data between the AWR Design Environment, Virtuoso, and Allegro platforms eliminates disconnection between RF design and manufacturing layout teams, saves valuable engineering resources, and positively impacts businesses. development schedules. With the V16 version and its extensive integrated electromagnetic (EM) and thermal analyzes, customers see a reduction of more than 3 times the TAT.

The main features of this version include:

  • Allegro integration: Ensures manufacturing compatibility and RF integration with PCB and IC package design workflows

  • Virtuoso integration: Operates Microwave Office for RF front-end design IP and combines it with Virtuoso Layout Suite for integrated circuits and modules integration

  • Integration of clarity: Enables EM analysis for design verification of large RF structures such as module packaging and phased array power networks

  • Celsius integration: Provides thermal analysis for monolithic microwave IC (MMIC) and high power RF PCB applications

  • AWR Improvements: Accelerates IP RF Creation with Advances in Design Automation and Finite Element Analysis (FEA) Solver Performance

Cadence platforms such as the AWR, Allegro PCB / SiP and Virtuoso RF design environment with embedded EM resolution technologies are critical to the development of our RF / mmWave MMIC, RFIC and multi-chip packaging technology. 2.5 / 3D ”, declared Florian Herrault. , Group Leader, Advanced Packaging Solutions at HRL Laboratories. “Our design team is very excited about the performance and productivity gains achieved with Cadence’s RF solutions. Having the ability to share the IP RF created in Microwave Office with our IC, box and card teams results in a significant reduction in our overall design time so that we can deliver the highest quality products to market faster. “

AWR V16 design environment supports Cadence intelligent system design strategy, enabling system-on-chip (SoC) design excellence and system innovation. The V16 platform has been released and is now available for download. For more information, please visit

About Cadence

Cadence is a pivotal leader in electronics design, drawing on over 30 years of computer software expertise. The company applies its underlying intelligent systems design strategy to deliver software, hardware, and intellectual property that turn design concepts into reality. Cadence customers are the most innovative companies in the world, providing extraordinary electronic products, from chips to boards to systems for the most dynamic applications in the market, including consumer computing, large-scale computing. , 5G communications, automotive, mobile telephony, aerospace, industry and health. For seven years in a row, Fortune magazine has named Cadence one of the Top 100 Companies to Work For. Learn more about

© 2021 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and other Cadence marks found on are trademarks or registered trademarks of Cadence Design Systems, Inc. All other marks are the property of their respective owners.

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